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Data Sheet No. PD60043-N IR2101(S) IR2102(S) HIGH AND LOW SIDE DRIVER Features * Floating channel designed for bootstrap operation Fully operational to +600V Tolerant to negative transient voltage dV/dt immune Gate drive supply range from 10 to 20V Undervoltage lockout 3.3V, 5V, and 15V logic input compatible Matched propagation delay for both channels Outputs in phase with inputs (IR2101) or out of phase with inputs (IR2102) Product Summary VOFFSET IO+/VOUT ton/off (typ.) Delay Matching 600V max. 130 mA / 270 mA 10 - 20V 160 & 150 ns 50 ns * * * * * Description Packages The IR2101(S)/IR2102(S) are high voltage, high speed power MOSFET and IGBT drivers with independent high and low side referenced output channels. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic con8 Lead SOIC struction. The logic input is compatible with stan8 Lead PDIP dard CMOS or LSTTL output, down to 3.3V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 600 volts. Typical Connection up to 600V VCC VCC HIN LIN VB HO VS LO up to 600V VCC TO LOAD HIN LIN COM IR2101 VCC HIN LIN VB HO VS LO TO LOAD HIN LIN COM (Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout. IR2102 www.irf.com 1 IR2101/IR2102 (S) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol VB VS VHO VCC VLO VIN dVS/dt PD RthJA TJ TS TL Definition High side floating supply voltage High side floating supply offset voltage High side floating output voltage Low side and logic fixed supply voltage Low side output voltage Logic input voltage (HIN & LIN) Allowable offset supply voltage transient Package power dissipation @ TA +25C Thermal resistance, junction to ambient Junction temperature Storage temperature Lead temperature (soldering, 10 seconds) (8 lead PDIP) (8 lead SOIC) (8 lead PDIP) (8 lead SOIC) Min. -0.3 VB - 25 VS - 0.3 -0.3 -0.3 -0.3 -- -- -- -- -- -- -55 -- Max. 625 VB + 0.3 VB + 0.3 25 VCC + 0.3 VCC + 0.3 50 1.0 0.625 125 200 150 150 300 Units V V/ns W C/W C Recommended Operating Conditions The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential. Symbol VB VS VHO VCC VLO VIN TA Definition High side floating supply absolute voltage High side floating supply offset voltage High side floating output voltage Low side and logic fixed supply voltage Low side output voltage Logic input voltage (HIN & LIN) (IR2101) & (HIN & LIN) (IR2102) Ambient temperature Min. VS + 10 Note 1 VS 10 0 0 -40 Max. VS + 20 600 VB 20 VCC VCC 125 Units V C Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details). 2 www.irf.com IR2101/IR2102 (S) Dynamic Electrical Characteristics VBIAS (VCC, VBS) = 15V, CL = 1000 pF and TA = 25C unless otherwise specified. Symbol ton toff tr tf MT Definition Turn-on propagation delay Turn-off propagation delay Turn-on rise time Turn-off fall time Delay matching, HS & LS turn-on/off Min. Typ. Max. Units Test Conditions -- -- -- -- -- 160 150 100 50 -- 220 220 170 90 50 ns VS = 0V VS = 600V Static Electrical Characteristics VBIAS (VCC, VBS) = 15V and TA = 25C unless otherwise specified. The VIN, VTH and IIN parameters are referenced to COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO. Symbol VIH VIL VOH VOL ILK IQBS IQCC IIN+ IINVCCUV+ VCCUVIO+ Definition Logic "1" input voltage (IR2101) Logic "0" input voltage (IR2102) Logic "0" input voltage (IR2101) Logic "1"input voltage (IR2102) High level output voltage, VBIAS - VO Low level output voltage, VO Offset supply leakage current Quiescent VBS supply current Quiescent VCC supply current Logic "1" input bias current Logic "0" input bias current VCC supply undervoltage positive going threshold VCC supply undervoltage negative going threshold Output high short circuit pulsed current Min. Typ. Max. Units Test Conditions 3 -- -- -- -- -- -- -- -- -- -- -- -- 30 150 3 -- V 0.8 100 100 50 55 270 10 A mV VCC = 10V to 20V IO = 0A IO = 0A VB = VS = 600V VIN = 0V or 5V VIN = 0V or 5V VIN = 5V (IR2101) VIN = 0V (IR2102) -- 8 7.4 130 -- 8.9 8.2 210 1 9.8 9 -- mA V VIN = 0V (IR2101) VIN = 5V (IR2102) VCC = 10V to 20V VO = 0V VIN = Logic "1" PW 10 s VO = 15V VIN = Logic "0" PW 10 s IO- Output low short circuit pulsed current 270 360 -- www.irf.com 3 IR2101/IR2102 (S) Functional Block Diagram VB Q PULSE FILTER R S VS HO HV LEVEL SHIFT HIN PULSE GEN UV DETECT VCC LIN LO COM IR2101 VB Q PULSE FILTER R S VS HO Vcc HIN HV LEVEL SHIFT PULSE GEN Vcc LIN UV DETECT VCC LO COM IR2102 4 www.irf.com IR2101/IR2102 (S) Lead Definitions Symbol HIN HIN LIN LIN VB HO VS VCC LO COM Description Logic input for high side gate driver output (HO), in phase (IR2101) Logic input for high side gate driver output (HO), out of phase (IR2102) Logic input for low side gate driver output (LO), in phase (IR2101) Logic input for low side gate driver output (LO), out of phase (IR2102) High side floating supply High side gate drive output High side floating supply return Low side and logic fixed supply Low side gate drive output Low side return Lead Assignments 8 Lead PDIP 8 Lead SOIC IR2101 IR2101S 8 Lead PDIP 8 Lead SOIC IR2102 www.irf.com IR2102S 5 IR2101/IR2102 (S) HIN LIN 50% 50% HIN LIN HIN LIN HIN LIN ton 50% 50% tr 90% toff 90% tf HO LO Figure 1. Input/Output Timing Diagram HO LO 10% 10% Figure 2. Switching Time Waveform Definitions HIN LIN 50% 50% HIN LIN 50% 50% LO HO 10% MT 90% MT LO HO Figure 3. Delay Matching Waveform Definitions 6 www.irf.com IR2101/IR2102 (S) 500 Turn-On Delay Time (ns) 400 300 200 100 Max. Turn-On Delay Time (ns) 500 400 300 200 Max. Typ. 100 0 Typ. 0 -50 -25 0 25 50 75 100 125 10 12 14 16 18 20 Temperature (C) VBIAS Supply Voltage (V) Figure 6A. Turn-On Time vs Temperature Figure 6B. Turn-On Time vs Supply Voltage 500 Turn-On Delay Time (ns 400 300 200 100 0 0 2 4 6 8 10 12 14 16 18 20 Turn-Off Delay Time (ns) 5 00 4 00 3 00 2 00 1 00 T yp . 0 -50 -25 0 25 50 75 Temperature (C) 1 00 1 25 M ax . Input Voltage (V) Figure 6C. Turn-On Time vs Input Voltage 500 Figure 7A. Turn-Off Time vs Temperature 500 Turn-Off Delay Time (ns 400 300 200 100 0 Typ. Max. Turn-Off Delay Time (ns) 400 300 200 Typ. 100 0 10 12 14 16 VBIAS Supply Voltage (V) 18 20 Max. 0 2 4 6 8 10 12 14 16 18 20 Input Voltage (V) Figure 7B. Turn-Off Time vs Supply Voltage Figure 7C. Turn-Off Time vs Input Voltage www.irf.com 7 IR2101/IR2102 (S) 500 500 Turn-On Rise Time (ns) 400 300 200 100 Typ. 0 -5 0 -2 5 0 25 50 75 100 125 Turn-On Rise Time (ns) 400 300 M ax. 200 100 Typ. 0 10 12 14 16 18 20 M ax. Temperature (C) VBIAS Supply Voltage (V) Figure 9A. Turn-On Rise Time vs Temperature Figure 9B. Turn-On Rise Time vs Voltage 20 0 200 Turn-Off Fall Time (ns) 15 0 Turn-Off Fall Time (ns) 150 M a x. 100 10 0 M ax. 50 Ty p. 0 -50 -25 0 25 50 75 10 0 12 5 50 Typ. 0 10 12 14 16 18 20 Temperature (C) VBIAS Supply Voltage (V) Figure 10A. Turn-Off Fall Time vs Temperature 8 7 I pu t V ol g e (V ) n ta Figure 10B. Turn-Off Fall Time vs Voltage 8 7 6 5 4 3 2 1 0 Mi n. I ut V ol np tage (V ) 6 5 4 3 2 1 0 -50 -25 0 25 50 75 10 0 12 5 Temperature (C) Mi. n 10 12 14 16 18 20 Vcc Supply Voltage (V) Figure 12A. Logic "1" Input Voltage (IR2101) Logic "0" Input Voltage (IR2102) vs Temperature 8 Figure 12B. Logic "1" Input Voltage (IR2101) Logic "0" Input Voltage (IR2102) vs Voltage www.irf.com IR2101/IR2102 (S) 4 3 .2 I p u t V o l g e (V ) n ta 2 .4 1 .6 M ax. 0 .8 0 -5 0 -2 5 0 25 50 75 100 125 Temperature (C) 4 3.2 I nput V o l e (V ) tag 2.4 1.6 M ax . 0.8 0 10 12 14 16 18 20 Vcc Supply Voltage (V) Figure 13A. Logic "0" Input Voltage (IR2101) Logic "1" Input Voltage (IR2102) vs Temperature 1 Figure 13B. Logic "0" Input Voltage (IR2101) Logic "1" Input Voltage (IR2102) vs Voltage 1 High Level Output Voltage (V) High Level Output Voltage (V) 0 .8 0 .6 0 .4 M ax. 0 .2 0 -5 0 -2 5 0 25 50 75 100 125 0 .8 0 .6 0 .4 0 .2 0 10 12 14 16 18 20 M ax. Temperature (C) Vcc Supply Voltage (V) Figure 14A. High Level Output vs Temperature 1 Figure 14B. High Level Output vs Voltage 1 Low Level Output Voltage (V) 0 .8 0 .6 0 .4 0 .2 0 -5 0 -2 5 0 25 50 75 100 125 Low Level Output Voltage (V) 0 .8 0 .6 0 .4 0 .2 M ax. 0 10 12 14 16 18 20 M ax. Temperature (C) Vcc Supply Voltage (V) Figure 15A. Low Level Output vs Temperature www.irf.com Figure 15B. Low level Output vs Voltage 9 IR2101/IR2102 (S) Offset Supply Leakage Current (A) 500 400 300 200 100 M ax. 0 -5 0 -2 5 0 25 50 75 100 125 500 Offset Supply Leakage Current (A) 400 300 200 100 0 0 100 200 300 400 500 600 Max. Temperature (C) VB Boost Voltage (V) Figure 16A. Offset Supply Current vs Temperature 1 50 150 Figure 16B. Offset Supply Current vs Voltage VBS Supply Current (A) 1 20 90 60 M ax . 30 T yp . 0 -50 -25 0 25 50 75 1 00 1 25 VBS Supply Current (A) 120 90 60 30 Ty p. 0 10 12 14 16 18 20 Max . Temperature (C) VBS Floating Supply Voltage (V) Figure 17A. VBS Supply Current vs Temperature 700 700 Figure 17B. VBS Supply Current vs Voltage Vcc Supply Current (A) 600 500 400 300 200 100 0 -5 0 -2 5 0 25 50 75 100 125 Typ. M ax. Vcc Supply Current (A) 600 500 400 300 200 100 Typ. 0 10 12 14 16 18 20 M ax. Temperature (C) Vcc Supply Voltage (V) Figure 18A. Vcc Supply Current vs Temperature 10 Figure 18B. Vcc Supply Current vs Voltage www.irf.com IR2101/IR2102 (S) 30 30 Logic 1" Input Current (A) Logic 1" Input Current (A) 25 20 15 10 M ax. 5 Typ. 0 -5 0 -2 5 0 25 50 75 100 125 25 20 15 10 5 0 10 12 14 16 18 20 M ax. Typ. Temperature (C) Vcc Supply Voltage (V) Figure 19A. Logic"1" Input Current vs Temperature 5 Logic "0" Input Current (uA) Logic "0" Input Current (A) Figure 19B. Logic"1" Input Current vs Voltage 5 4 3 2 Max. 1 0 4 3 2 Max. 1 0 -50 -25 0 25 50 75 Temperature (C) 100 125 10 12 14 16 VCC Supply Voltage (V) 18 20 Figure 20A. Logic "0" Input Current vs Temperature 11 VCC UVLO Threshold - (V) VCC UVLO Threshold +(V) Figure 20B. Logic "0" Input Current vs Voltage 11 M ax. 10 9 8 7 6 -50 -25 0 25 50 75 100 125 Temperature (C) 10 Max. 9 Typ. 8 7 Min. Typ. Mi n. 6 -50 -25 0 25 50 75 100 125 Temperature (C) Figure 21A. Vcc Undervoltage Threshold(+) vs Temperature www.irf.com Figure 21B. Vcc Undervoltage Threshold(-) vs Temperature 11 IR2101/IR2102 (S) 500 Output Source Current (mA) Output Source Current (mA) 500 400 300 200 Typ. 100 Min. 0 -25 0 25 50 75 Temperature (C) 100 125 400 300 200 100 Min. Typ. 0 -50 10 12 14 16 18 VBIAS Supply Voltage (V) 20 Figure 22A. Output Source Current vs Temperature 7 00 Output Sink Current (mA) Output Sink Current (mA) Figure 22B. Output Source Current vs Voltage 70 0 60 0 50 0 40 0 30 0 20 0 Mi n. 10 0 0 10 12 14 16 18 20 Ty p. 6 00 5 00 4 00 3 00 Mi. n 2 00 1 00 0 -50 -25 0 25 50 75 1 00 1 25 Temperature (C) T yp . VBIAS Supply Voltage (V) Figure 23A. Output Sink Current vs Temperature Figure 23B. Output Sink Current vs Voltage 12 www.irf.com IR2101/IR2102 (S) Case outlines 8 Lead PDIP D A 5 B FOOTPRINT 8X 0.72 [.028] 01-6014 01-3003 01 (MS-001AB) INCHES MIN .0532 .013 .0075 .189 .1497 MAX .0688 .0098 .020 .0098 .1968 .1574 MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 DIM A b c D A1 .0040 6 E 8 7 6 5 H 0.25 [.010] A E 6.46 [.255] 1 2 3 4 e e1 H K L 8X 1.78 [.070] .050 BASIC .025 BASIC .2284 .0099 .016 0 .2440 .0196 .050 8 1.27 BASIC 0.635 BASIC 5.80 0.25 0.40 0 6.20 0.50 1.27 8 6X e e1 3X 1.27 [.050] y A C 0.10 [.004] y K x 45 8X b 0.25 [.010] A1 CAB 8X L 7 8X c NOTES: 1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE C ONFORMS TO JEDEC OUTLINE MS-012AA. 5 DIMENSION DOES NOT INC LUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXC EED 0.15 [.006]. 6 DIMENSION DOES NOT INC LUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXC EED 0.25 [.010]. 7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 8 Lead SOIC 01-6027 01-0021 11 (MS-012AA) IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105 Data and specifications subject to change without notice. 4/18/2003 www.irf.com 13 |
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